三浦春马图片
专利名称：Registration mark for resist pattern
formation and production manner null 发明人：足立 和正，三宅 栄一
申请号：JP特願平9-320316
申请日：19971106
公开号：JP特許第3324973号(P3324973)B2
公开日：
20020917
摘要：PROBLEM TO BE SOLVED: To provide a positioning mark, which can be used in a semi-additive method, will not reduce the precision of alignment of a photomask film with a substrate and can be read, even if a photosensitive dry film is pressure-bonded to the mark, and to provide a method of manufacturing a multilayered printed wiring board using the mark. SOLUTION: Ring recessed parts 64 are formed in an inter-layer insulating layer 38, and a positioning mark 66 is formed by precipitating a copper electroless plated film 40 by an electroless plating. When the alignment of a photomask film 70 with a substrate 20 is performed, a difference between the quantity of reflection of the film 40, which comes into contact with a dry film 41, and the quantity of reflection of the film 40 located at the mark 66, which does not come into contact with the film 41, is read by a CCD camera 200 and the mark 66 is recognized as a ring mark. As the ring part of the mark 66 reflects light strongly, the outline of the ring of the ring part can be clearly identified.
申请人：イビデン株式会社,サンエー技研株式会社
地址：岐阜県大垣市神田町2丁目1番地，兵庫県尼崎市金楽寺町1丁目3-30
国籍：JP,JP
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