FP6605
USB Type C And USB-PD Charging Controller
Description The FP6605 is a simply USB Power Delivery (PD) protocol controller. It integrated functions for HiSilicon Fast Charging Protocol (FCP) and Qualcomm Quick Charge 2.0/3.0. The FP6605 monitors the CC pin to detect a USB Type C attach/detach. It is capable providing output voltage of 5V to 15V. The FP6605 implements VBUS detection and discharge for the implementation of compliant connection ports. The protection features include over-voltage (CC Pin VBUS, D+ D-). Pin Assignments
SP SOP-8 Package( Exposed Pad)
VBUSC O Ordering Information
FP6605-
□□□
Features
● VDD Supply Voltage: 3.2V to 6.8V
● Supports USB Type-C and Power Delivery
-- 5V to 15V VBUS Source Only
-- CC1/CC2 Source Terminator 3A
● Supports HiSilicon Fast Charging Protocol (FCP)
● Supports Qualcomm ® Quick Charge TM 2.0/3.0
Class A
● Automatically Selects FCP and QC2.0/3.0 Protocols
● Over-voltage and VBUSC Discharge Function
● SOP-8 Package( Exposed Pad)
Applications ● Wall-Adapter ● Car Charger ● Power Strip ● USB Power Output Port
Package Type
SP: SOP-8(Exposed Pad)
Watt Selection
18: 18W 27: 27W
30: 30W 45: 45W
Source Capability
Please Reference
Marking Information fitipower 一级代理商
代理:CRE6959VH-S2,FKS4004,NS6116,FP6601Q,FP6605,FP6608
FP6605 Typical Application Circuit
Figure 1. Typical Application Schematic
Block Diagram
VDD GND R C G C
Absolute Maximum Ratings (Note 1)
● Input Supply Voltage VDD ------------------------------------------------------------------------------ -0.3V to +7V
● DPC, DMC ------------------------------------------------------------------------------------------------- -0.3V to +18V
● CC1, CC2 -------------------------------------------------------------------------------------------------- -0.3V to +18V
● SRCGC, VBUSC ----------------------------------------------------------------------------------------- -0.3V to +35V
● Maximum Junction Temperature (T J) --------------------------------------------------------------- +150°C
● Storage Temperature (T S) ------------------------------------------------------------------------------ -65°C to +150°C
● Lead Temperature (Soldering, 10sec.) -------------------------------------------------------------- +260°C
● Package Thermal Resistance, (θJA) (Note 2)
SOP-8 (Exposed Pad)----------------------------------------------------------------------- 60°C/W
● Package Thermal Resistance, (θJC)
SOP-8 (Exposed Pad)----------------------------------------------------------------------- 15°C/W
Note 1: Stresses beyond this listed under “Absolute Maximum Ratings" may cause permanent damage to the device. Note 2: θJA is measured at 25°C ambient with the component mounted on a high effective thermal conductivity test board of JEDEC-51-7.
● Input supply voltage (VDD) ---------------------------------------------------------------------------- 3.2V to 6.8V
● Operating temperature range (T A) ------------------------------------------------------------------- -40°C to +125°C
● Junction temperature (T J) ------------------------------------------------------------------------------ -40°C to +125°C
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