专利名称：Thermal explanation/releasing structure of
circuit substrate
发明人：李念倫，王福蔭，呉雅惠，李建玄
申请号：JP2004007526
申请日：20041221
公开号：JP3109750U
公开日：
20050602
专利内容由知识产权出版社提供linian
专利附图：
摘要：< Topic >A better thermal explanation/releasing effect is achieved by the circuit substrate, thermal explanation/releasing structure of the circuit substrate where working efficiency of the control IC improves is offered.SolutionsThe circuit substrate is used
adjusting to the fan, the fan, consists of with the frame and the stator and the feather and circuit substrate 14, the electronic device 141 of one or more and control IC142, is installed on circuit substrate 14, in addition, circuit substrate 14 putting, after, the thermal explanation/releasing area 2 installs in the position where it corresponds to control IC142, is a radiator 21,22 which consists of two, many through holes 23 in the
thermal explanation/releasing area 2, because of this, control IC142 is installed in circuit substrate 14, as for phase of control IC142, circuit substrate 14It corresponds with the thermal explanation/releasing area 2 mutually. < Choice figure >Drawing 4申请人：達隆科技股▲ふん▼有限公司
地址：台灣台北縣新莊市思源路１００號
国籍：TW
代理人：鈴木 征四郎
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