专利名称：Thermal explanation/releasing structure ofcircuit substrate发明人：李念倫，王福蔭，呉雅惠，李建玄申请号：JP2004007526申请日：20041221公开号：JP3109750U公开日：20050602专利内容由知识产权出版社提供linian专利附图：摘要：< Topic >A better thermal exp...