专利名称:Metal polishing agent and process for polishing metal using same
发明人:Takashima, Masayuki,Sawara,
Kenichi,Sukumoda, Atsushi
申请号:EP98122108.8
申请日:19981123
公开号:EP0919602A1
公开日:
19990602
摘要:There is provided a metal polishing agent comprising an aqueous emulsion comprising a complexing agent capable of reacting with a metal to form a water soluble metal complex and a resin particle prepared by emulsion polymerization of a vinyl compound, which is particularly useful for polishing a metal film formed on a silicon wafer by a chemical and mechanical polishing.
申请人:Sumitomo Chemical Company, Limited
soojoo地址:5-33, Kitahama 4-chome Chuo-ku Osaka 541-8550 JP
国籍:JP
代理机构:VOSSIUS & PARTNER
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