IPC标准、文件一览表
Updated May 24, 2000
IPC DOC # (IPC文件号) TITLE
名称
PUBLICATION/
REVISION DATES
出版/修订日期
Roadmap (指南)National Technology Roadmap for Electronic
Interconnections
6/95 (orig. pub.)
SMC-TR-
001SMT An Introduction to Tape Automated Bonding & Fine
Pitch Technology(TAB和细间距SMT介绍)
1/89 (orig. pub.)
J-STD-001 代替IPC-S-815Requirements for Soldered Electrical and Electronic
Assemblies
(电气、电子组件焊接技术要求)
4/92 (orig. pub.)
Revision: A 1/95
Amendment 1: 3/96
Revision B: 10/96
Revision C: 3/00
IPC-HDBK-001Handbook and Guide to the Requirements for Soldered
Electrical and Electronic Assemblies to Supplement J-
STD-001B
(J-STD-001B学习辅导书)
3/98 (orig. pub.)
J-STD-002 代替IPC-S-805Solderability Tests for Component Leads,Terminations,
Lugs, Terminals and Wires (元件引线，焊端，接线端和导
线的可焊性
测试)
4/92 (orig. pub.)
A 10/98
J-STD-003
代替IPC-S-804Solderability Tests for Printed Boards(印制板可焊性测
试)
4/92 (orig. pub.)
Revision A: In process
J-STD-004
代替IPC-SF-818Requirements for Soldering Fluxes(助焊剂技术要求)
1/95 (orig. pub.)
Amendment 1 - 4/96
Revision A: In process
J-STD-005
代替IPC-SF-819Requirements for Soldering Pastes(焊膏技术要求)
1/95 (orig. pub.)
Amendment 1 - 1/95
J-STD-006Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic
Soldering Applications 1/95 (orig. pub.) Amendment 1 - 6/96 Revision A: In process
(电子级固态焊料技术要求)
J-STD-012
Implementation of Flip Chip and Chip Scale Technology
(FC和CSP器件的安装)
1/96 (orig. pub.)
J-STD-013Implementation of Ball Grid Array and Other High
Density Technology(BGA和HDI器件的安装)
7/96 (orig. pub.)
IPC-DRM-
18Component Identification Desk Reference Manual
(元器件封装辨认手册)
9/95 (orig. pub.)
Revision A: 4/96
Revision B: 2/97
Revision C: 7/98
J-STD-020Moisture/Reflow Sensitivity Classification of Plastic
Surface Mount Devices(塑封表面器件对潮湿和再流焊
的敏感度要求)
October 1996 (orig.
pub.)
Revision A: 3/99
IPC-DRM-
40Through-Hole Solder Joint Evaluation Desk Reference Manual
(通孔引线焊点评估参考手册)
IPC-DRM-
SMT Surface Mount Solder Joint Evaluation Desk Reference Manual
(表面组装焊点评估参考手册)
8/98
IPC-T-50Terms and Definitions Interconnecting and Packaging
Electronic Circuits(电子电路互连及封装术语和定义)
8/75 (orig. pub.)
A - 8/76
B - 6/80
C - 3/85
D - 11/88
E - 7/92
F - 6/96
IPC-SC-60Post Solder Solvent Cleaning Handbook (焊后溶剂清洗
手册)
4/87 (orig. pub.)
Revision A: In process
IPC-SA-61
Post-Solder Semi-Aqueous Cleaning Handbook
b总001(焊后半水清洗手册)
7/95 (orig. pub.)
IPC-AC-62Post Solder Aqueous Cleaning Handbook (焊后水清洗手
册)
12/86 (orig. pub.)
IPC-CH-65
Guidelines for Cleaning of Printed Boards and Assemblies
(印制板及其组件清洗导则) 12/90 (orig. pub.) Revision A: In process
IPC-CS-70Guidelines for Chemical Handling Safety in Printed Board Manufacturing(印制板制造化学处理安全准则)
8/88 (orig. pub.)
IPC-CM-
78
被IPC-SM-780替
代Guidelines for Surface Mounting and Interconnecting
Chip Carriers
11/83 (orig. pub.)
C - 3/88
IPC-MP-
83
IPC Policy on Metrication(IPC公制化导则) 8/85 (orig. pub.)
IPC-PC-90General Requirements for Implementation of Statistical
Process Control(实施SPC的总技术规范)
10/90 (orig. pub.)
IPC-QS-95General Requirements for Implementation of ISO 9000
Quality Systems(实施ISO 9000质量体系的总技术规
范)
4/93 (orig. pub.)
IPC-L-108
被IPC-4101替代Specification for Thin Metal Clad Base Materials for
Multilayer Printed Boards
3/76 (orig. pub.)
A 10/80
B 6/90
IPC-L-109
被IPC-4101替代Specification for Resin Impregnated Fabric (Pregreg) for
Multilayer Printed Boards
3/76 (orig. pub.)
A 10/80
B 7/92
IPC-L-110 (已作废)Preimpregnated, B-Stage Epoxy-Glass Cloth for
Multilayer Printed Cicuit Boards
A
IPC-CC-
110 被IPC-4121替代Guidelines for Selecting Core Constructions for
Multilayer Printed Wiring Board Applications
1/94 (orig. pub.)
Revision A: 12/97
IPC-L-112 被IPC-4101替代Specification for Composite Metal Clad Base materials for
Printed Boards
7/81 (orig. pub.)
A 6/92
IPC-L-115 被IPC-4101替代Specification for Rigid Metal Clad Base Materials for
Printed Boards
3/77 (orig. pub.)
A 10/80
B 4/90
IPC-L-120 (己作废)Inspection Procedure for Chemical Processing Suitability of Copper-Clad Epoxy-Glass Laminates
IPC-L-125Specifications for Plastic Substrates Clad or Unclad for
High Speed/High Frequency Interconnections
(高速/高频塑性基板特性规范)
8/83 (orig. pub.)
A 7/92
IPC-L-130
(已作废)被IPC-L-108替代Specificaitons for Thin Laminates, Metal Clad, Primarily
for General-Purpose Multilayer Printed Boards
1/77 (orig. pub.)
IPC-EG-
140Specification for Finished Fabric Woven from "E" Glass
for Printed Boards("E"纤维织物印制板特性规范)
3/88 (orig. pub.)
A 6/97*
IPC-SG-
141Specification for Finished Fabric Woven from "S" Glass
for Printed Boards ("S"纤维织物印制板特性规范)
2/92 (orig. pub.)
IPC-A-142Specification for Finished Fabric Woven from Aramid for
Printed Boards(Aramid纤维织物印制板特性规范)
6/90 (orig. pub.)
IPC-QF-
143General Specification for Finished Fabric Woven from
Quartz (Pure Fused Silica) for Printed Boards
(石英纤维织物印制板特性规范)
2/92 (orig. pub.)
IPC-CF-
148Resin Coated Metal for Printed Boards (印制板涂树脂金
属箔)
6/90 (orig. pub.)
A 9/98
IPC-MF-
150Metal Foil for Printed Wiring Applications
(印制线路金属箔)
8/66 (orig.pub.)
A 9/67
B 2/71
C 8/74
D 3/76
E 5/81
F 10/91 , 8/92
G 5/99
IPC-CF-
152Composite Metallic Material Specification for Printed
Wiring Boards (印制板复合金属材料特性规范)
6/90 (orig. pub.)
A 1/94
B 3/98
IPC-FC-
203 (已作废)Specification for Flat Cable, Round Conductor, Ground
Plane
7/85 (orig. pub.)
IPC-FC-
210 (已作废)Performance Specification for Flat-Conductor
Undercarpet Power Cable (Type FCC)
9/85 (orig. pub.)
IPC-FC-
213 (已作废)Performance Specification for Flat Undercarpet Telephone
Cable
9/84 (orig. pub.)
IPC-FC-
217 (已作废)General Document for Connectors, Electric, Header,
Receptacle,Insulation Displacement for Use with Round
Conductor Flat Cable
8/82 (orig. pub.)
Reaffirmed 4/90
IPC-FC-
218B/ EIA-RS-
429 (已作废)General Specification for Connectors, Electrical Flat
Cable Type
7/76 (orig. pub.)
Reaffirmed 11/81
Reaffirmed 05/91
IPC-FC-
219Environment Sealed Flat Cable Connectors for use in
(已作废)Aerospace Applications 5/84 (orig. pub.) IPC-FC-
220 (已作废)Specification for Flat Cable, Flat Conductor, Unshielded
orig. pub 5/70
A 1/74
B 8/75
C 7/85
IPC-FC-
221 (已作废)Specification for Flat-Copper Conductors for Flat Cables
8/75 (orig. pub.)
A 5/84
IPC-FC-
222 (已作废)Specification of Flat Cable Round Conductor, Unshielded
6/80 (orig. pub.)
5/91 Reaffirmed
IPC-FC-
225 (已作废)Flat Cable Design Guide
8/75 (orig. pub.)
10/85 Reaffirmed
IPC-FC-
231Flexible Base Dielectrics for Use in Flexible Printed
Wiring
(柔性印制线路的绝缘基材)
orig. pub. 7/74
A 5/83
B 2/86
C 4/92
Amendment 10/95
IPC-FC-
232 代替IPC-FC-233A Adhesive Coated Dielectric Films for Use as Cover Sheets
for Flexible Printed Wiring and Flexible Bonding Films
(柔性电路绝缘涂覆胶粘剂)
7/74 (orig. pub.)
A 5/83
B 2/86
C 4/92
Amendment 10/95
IPC-FC-
233 (作废)-
Incorporated into IPC-
FC-232B
IPC-FC-
241 Flexible Metal-Clad Dielectrics for Use in Fabrication of
Flexible Printed Wiring(柔性印制电路镶嵌金属夹层的
绝缘基材)
7/74 (orig. pub.)
A 5/83
B 2/86
C 4/92
Amendment 10/95
IPC-RF-
245
被IPC-
6013
替代
Performance Specification for Rigid-Flex Printed Boards 4/87 (orig. pub.) IPC-D-249
被IPC-2223替代Design Standard for Flexible Single-and Double-Sided
Printed Boards
1/87 (orig. pub.)
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